Electroluminescence display and method for manufacturing the same

ABSTRACT

An electroluminescence display and a manufacturing method therefore are disclosed in the present invention. The present invention combines an electroluminescence component and a passive component into a single display component for a display screen. The present invention has a simple manufacturing process, and decreases power consumption and the total size of a display screen.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of copending application Ser. No.11/356,969, filed Feb. 21, 2006, and the right of priority of parentapplication is and was claimed under 35 USC §119 of TaiwaneseApplication No. 094129716, filed Aug. 30, 2005, the entire disclosure ofwhich is incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a display and a method formanufacturing the same, and more particularly, to an electroluminescencedisplay and a method for manufacturing the same.

2. Description of Related Art

A display screen is an interface for general electronic equipment or aflexible electronic system. A super-thin flexible electronic systemusually uses a reflective liquid crystal display. However, sometimes ituses a self-emitting display in a special environment. An organiclight-emitting diode (hereinafter abbreviated as OLED) is the bestchoice as a light source for a self-emitting display on a flexiblesubstrate. Therefore, a super-thin flexible electronic system mustinclude OLED as a core technology for the flexible substrate.

Several conventional OLED application patents have been developed forsatisfying the demands stated above. U.S. Pat. No. 6,541,908,“Electronic light emissive displays incorporating transparent andconductive zinc oxide thin film”, discloses the use of co-doped zincoxide (n-type) as the cathode of organic light-emitting diode (OLED)display, field emission displays (FEDs) and vacuum microelectronicdevices. U.S. Pat. No. 6,744,197 and U.S. patent App. No. 2003/0205969A1discloses an organic electroluminescent display device and method offabricating same. US patent App. Nos. 2003/0227582A1 and 2004/0090569A1,U.S. Pat. Nos. 6,734,930B2 and 6,738,113B2 disclose a structure for anorganic light-emitting material TFT LCD and a method for making thesame.

US patent App. No. 2002/0033908A1 discloses a liquid crystal display forlowering power consumption. U.S. Pat. No. 6,777,710 discloses an organiclight-emitting device with constant luminance. US patent App. No.2003/0063231A1 discloses a LCD panel integrated with OLED.

SUMMARY OF THE INVENTION

The main object of the present invention is to provide anelectroluminescence display and a method for manufacturing the samewhich decreases both power consumption and the size of the display.

For achieving the object as stated above, the present invention providesa manufacturing method for an electroluminescence display comprising:proving an upper substrate and a bottom substrate; forming a conductivelayer on said bottom substrate; forming a plurality of wall structureson said conductive layer; filling a plurality of liquid crystal displaymedia on at least one first space, wherein the at least one first spaceis formed by said wall structures; forming a plurality of organicmaterial on at least one second space, wherein the at least one secondspace is formed by said wall structures; making a plurality of seals andat least one third space on said conductive layer; forming a protectivelayer on said liquid crystals; and combining said upper substrate andsaid bottom substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing aspects and many of the attendant advantages of thisinvention will be more readily appreciated as the same becomes betterunderstood by reference to the following detailed description, whentaken in conjunction with the accompanying drawings, wherein:

FIG. 1 shows a bottom substrate made in accordance with themanufacturing procedure of the present invention;

FIG. 2 shows wall structures made in accordance with the manufacturingprocedure of the present invention;

FIG. 3 is a schematic diagram of the passive reflective component inaccordance with the present invention;

FIG. 4 is a schematic diagram of the electroluminescence component inaccordance with the present invention;

FIG. 5 shows a seal made in accordance with the manufacturing procedureof the present invention; and

FIG. 6 is a schematic diagram of the combination of the passive displaycomponent with the electroluminescence display component in accordancewith the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present invention uses an electroluminescence component togetherwith a passive component to provide a display (may be bistable display)having electroluminescence component and passive component. Reference ismade to FIGS. 1-6, which show a manufacturing procedure for anelectroluminescence display in accordance with a preferred embodiment ofthe present invention. The manufacturing procedure comprises the stepsdescribed as follows.

Reference is made to FIG. 1, which shows a bottom substrate made inaccordance with the manufacturing procedure of the present invention.First, a bottom substrate 10 is provided. The bottom substrate 10 isplastic substrate, metal-foil substrate or glass substrate. The plasticmaterial can be polyethylene terephthalate, polyethersulfone (PES),polycarbonate, photopolymer resins or thermosetting resins. The bottomsubstrate 10 has a color filter layer formed thereon (not shown).Forming this color filter layer is not essential in the manufacturingprocess. Subsequently, a conductive layer 12 is formed on the bottomsubstrate 10. Forming the conductive layer 12 utilizes LTPS or otherrelated manufacturing techniques. The conductive layer 12 can be a TFThaving a driving circuit. The conductive layer 12 is designed to be adriving electrode for the passive component and the electroluminescencecomponent.

Reference is made to FIG. 2, which shows wall structures made inaccordance with the manufacturing procedure of the present invention. Aplurality of wall structures 14 are formed on the conductive layer 12.Forming the wall structures 14 on the conductive layer 12 furthercomprises a photosynthesis layer formed on the conductive layer 12 via acoating process. A photoresistant layer is formed on the photosynthesislayer via a coating process. The wall structures are defined and formedusing a mask and an etching process.

Reference is made to FIG. 3, which shows a schematic diagram of thepassive reflective component in accordance with the present invention. Aplurality of liquid crystal display media 16 can be filled in at leastone first space 18 (shown in FIG. 2) between the wall structures 14 viaa one-drop-fill (ODF) process. When the filling step is finished, thesubstrate having the passive reflective component will be formed.

Reference is made to FIG. 4, which shows a schematic diagram of theelectroluminescence component in accordance with the present invention.First, the substrate having the passive reflective component is moved onan Organic Light Emitting Diode fixture and a vacuum is created. Aplurality of organic material 20 is formed on at least one second space22 between the wall structures 14 via a distillation process. Theorganic materials 20 are made of organic light emitting diodes. Thepassive reflective component is covered with a shadow mask design sothat it is not covered by the distillation material. A cathode material20 also has the shadow mask design that is different from a generalorganic light emitting diode process. Thus the substrate having theelectroluminescence component is formed.

Next, a plurality of seals 24 and at least one third space 26 is made onthe conductive layer 12 as shown in FIG. 5. A bottom is made when theabove processes are finished. Therein, the bottom may be having abistable component. Reference is made to FIG. 6, which shows a schematicdiagram of the combination of the passive display component with theelectroluminescence display component in accordance with the presentinvention. A top substrate 28 is combined with the bottom via a pressingprocess or an ultraviolet exposure process. Therein, the bottom may behaving a bistable component. The top substrate 28 is composed of plasticsubstrate, metal-foil substrate or glass substrate. The plastic materialcan be polyethylene terephthalate, polyethersulfone (PES),polycarbonate, photopolymer resin or thermosetting resin. Surplus liquidcrystal display media 16 of the passive reflective component exudeinside the third component 26 when the pressing process is beingperformed. Finally, the polymer inside the liquid crystal display media16 is separated and cured thereon via the ultraviolet exposure to form aprotective layer 30. The protective layer 30 seals the liquid crystaldisplay media 16 so that the liquid crystal display media 16 is notcontacted by the electroluminescence component in actual application.The electroluminescence display (may be a passive reflective componentor a passive transparent component) is made through the combinationprocess.

The type of organic light emitting diode may be either a top emitter, abottom emitter or two-side emitter organic light-emitting diode. If atop emitter is selected for the organic light emitting, the displayhaving organic light emitting diode does not require a backlight becausethe cathode is transparent. The display with a transflective function isthinner, lighter and easier to assembly.

Alternatively, when a bottom emitter is selected for the organic lightemitting diode, there are two independent driving circuits. A firstdriving circuit sits on the organic materials and a second drivingcircuit sits on the liquid crystal display media. The first drivingcircuit is designed inside of the second driving circuit. This typecould be applied to a mobile panel and decreases the weight andthickness of the display panel. In addition, it also increases theopening rate of the organic materials of the bottom emitter.

It is to be understood, however, that even though numerouscharacteristics and advantages of the present invention have been setforth in the foregoing description, together with details of thestructure and function of the invention, the disclosure is illustrativeonly, and changes may be made in detail, especially in matters of shape,size, and arrangement of parts within the principles of the invention tothe full extent indicated by the broad general meaning of the terms inwhich the appended claims are expressed.

1. A manufacturing method for an electroluminescence display, comprisingthe following steps: providing an upper substrate and a bottomsubstrate; forming a conductive layer on said bottom substrate; forminga plurality of wall structures on said conductive layer; filling aplurality of liquid crystal display media on at least one first space,wherein the at least one first space is formed by said wall structures;forming a plurality of organic materials on at least one second space,wherein the at least one second space is formed by said wall structures;making a plurality of seals and at least one third space on saidconductive layer; forming a protective layer on said liquid crystaldisplay media; and combining said upper substrate and said bottomsubstrate.
 2. The method as claimed in claim 1, wherein theelectroluminescence display is a passive reflective component or apassive transparent component.
 3. The method as claimed in claim 1,wherein the upper substrate and the bottom substrate are a plasticsubstrate, metal-foil substrate or a glass substrate.
 4. The method asclaimed in claim 3, wherein the material of the plastic substrate isPolyethylene terephthalate (PET), Polyethersulfone (PES), Polycarbonate,photopolymer resin or thermosetting resin.
 5. The method as claimed inclaim 1, further comprising forming a color filter on the uppersubstrate.
 6. The method as claimed in claim 1, wherein the step offorming the wall structures on the conductive layer further comprises:forming a photosynthesis layer on said conductive layer; forming aphotoresistant layer on said photosynthesis layer; and using a mask todefine and form said wall structures.
 7. The method as claimed in claim6, wherein the photosynthesis layer is formed via a coating process. 8.The method as claimed in claim 6, wherein the photoresistant layer isformed via a coating process.
 9. The method as claimed in claim 6,wherein the wall structures are formed via an etching process.
 10. Themethod as claimed in claim 1, wherein the step of filling is performedvia a one-drop-fill process.
 11. The method as claimed in claim 1,wherein the organic materials are formed via a distillation process. 12.The method as claimed in claim 1, wherein the organic materials are madeof an organic light-emitting diode.
 13. The method as claimed in claim1, wherein the protective layer is formed via a polymerization inducedultraviolet exposure.
 14. The method as claimed in claim 1, wherein thestep of combining is performed via a pressing process.
 15. The method asclaimed in claim 1, wherein the step of combining is performed via anultraviolet exposure.